半导体器件
(semiconductor device)是利用半导体材料的特殊电特性来完成特定功能的。半導體的導電性介於良導電體與絕緣體之間,这些半导体材料通常是硅、锗或砷化镓,並經過各式特定的滲雜,產生P型或N型半導體,作成整流器、振盪器、發光器、放大器、測光器等元件或設備。[註 1]
可靠性
- 半导体器件对杂质和灰尘很敏感。所以在繁复的生产工艺中,精确控制杂质和灰尘的等级是非常必要的。最终产品的品質很大程度上依靠生产中的各个相对独立而又相互影响的生产阶段,例如金属化(metallization),芯片材料(chip material), 封装等。
- 由于技术飞速进步,新材料和新工艺不断被用于新研发的器件中,设计时间表根据非循环工程常数(non-recurring engineering)限定,再加上市场对设计时间不断提出苛刻要求,所以可靠性设计基本不可能按照已有的产品进行。
- 为达到一定的经济指标,半导体产品总1大批量生产的;并且修理半导体产成品也是不实际的。所以半导体产品在设计阶段加入可靠性的概念和在生产阶段减少变量就成为十分必要的要求。
- 半导体器件可靠性取决于装配,使用,环境状况。影响因素包括气体,灰尘,沾污,电压,电流密度,温度,湿度,应力,往复振动,剧烈震荡,压强和电磁场的强度。
设计方面影响半导体器件可靠性的因素包括:电压衰退,功率衰退,电流衰退,稳定性,逻辑时间变差(logic simulation),时效分析(timing analysis),温度衰退和工艺控制。
参考文献
- Giulio Di Giacomo (Dec 1, 1996), Reliability of Electronic Packages and Semiconductor Devices, McGraw-Hill
- A. Christou and B.A. Unger (Dec 31, 1989), Semiconductor Device Reliability, NATO Science Series E
- Michael Pecht, Riko Radojcic, and Gopal Rao (Dec 29, 1998), Guidebook for Managing Silicon Chip Reliability (Electronic Packaging Series), CRC Press LLC
- MIL-HDBK-217F Reliability Prediction of Electronic Equipment
- MIL-HDBK-251 Reliability/Design Thermal Applications
- MIL-HDBK-H 108 Sampling Procedures and Tables for Life and Reliability Testing (Based on Exponential Distribution)
- MIL-HDBK-338 Electronic Reliability Design Handbook
- MIL-HDBK-344 Environmental Stress Screening of Electronic Equipment
- MIL-STD-690C Failure Rate Sampling Plans and Procedures
- MIL-STD-721C Definition of Terms for Reliability and Maintainability
- MIL-STD-756B Reliability Modeling and Prediction
- MIL-HDBK-781 Reliability Test Methods, Plans and Environments for Engineering Development, Qualification and Production
- MIL-STD-1543B Reliability Program Requirements for Space and Missile Systems
- MIL-STD-1629A Procedures for Performing a Failure Mode, Effects, and Criticality Analysis
- MIL-STD-1686B Electrostatic Discharge Control Program for Protection of Electrical and Electronic Parts, Assemblies and Equipment (Excluding Electrically Initiated Explosive Devices)
- MIL-STD-2074 Failure Classification for Reliability Testing
- MIL-STD-2164 Environment Stress Screening Process for Electronic Equipment
参考文献
引用
- 施敏《半導體元件物理學》(Physics of Semiconductor Devices)
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